We provide high-precision surface mount and through-hole assembly for boards ranging from simple single-layer designs to complex high-density BGA and fine-pitch assemblies. Our automated lines and skilled engineers handle prototype quantities through large production runs.
SMT Assembly — automated pick-and-place for 01005 to large connectors
Through-Hole Assembly — manual and selective soldering for leaded components
BGA & QFN Placement — precision placement with X-ray verification
Reflow Soldering — nitrogen-atmosphere ovens for lead-free and leaded profiles
Wave Soldering — controlled for through-hole and mixed assemblies
Double-Sided Assembly — top and bottom component placement support
Our assembly line is equipped with industry-leading equipment to handle the most demanding components and board configurations.
Minimum component size: 01005 (0.4mm × 0.2mm)
BGA pitch down to 0.3mm
IPC-A-610 Class 2 and Class 3 workmanship standards
Nitrogen reflow for oxidation-sensitive components
Conformal coating (acrylic, silicone, urethane)
Underfill and potting services for mechanical protection
Every assembled board undergoes multiple quality checkpoints before shipment.
Automated Optical Inspection (AOI) post-reflow
Solder paste inspection (SPI) pre-placement
X-ray inspection for BGA and hidden solder joints
First Article Inspection (FAI) for new part numbers
IPC-certified operators and inspectors
Full traceability — component lot, date codes, and serial numbers
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